| Item | Process Capabilities | Remark | ||
| Number of layers | 1-6L | Single-sided hollow board | ||
| Panel size | 250*470mm max | |||
| Line | Minimum line width | 0.035mm | ||
| Minimum line distance | 0.035mm | |||
| Drilling | Minimum drilling | 0.1mm | Laser drilling <0.1mm | |
Dimensional tolerance | Dimensions | ±0.05mm | ||
| Finger margin | ±0.05mm | Special control ±0.03mm | ||
| Reinforcement fit tolerance | ±0.05mm | |||
| Solder mask positioning accuracy | ±0.05mm | |||
| Resistance | Differential Impedance | ±8% | ||
| Single-ended impedance | ±8% | |||
| Ground resistance | ≤1Ω | |||
| Line internal resistance | ≤100mΩ | R=ρL/S (R resistance, S cross-sectional area, L length, ρ resistivity) (copper resistivity ρ=0.0175) | ||
Surface treatment | Gold plated | Au | ≥0.025um | |
| Ni | 1.5-10um | |||
Immersion Gold | Au | 0.025-0.1um | ||
| Ni | 1.0-10um | |||
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